A New Era for Label Production in Chicago
LOUPE Americas 2026—the rebranded successor to Labelexpo—is serving as the stage for a major technology showcase from LemuGroup. The company has announced plans to operate four live production demonstrations across two separate booths, aiming to prove that the future of label converting lies in modularity, automation, and speed.
From on-demand Braille marking to high-speed RFID validation, LemuGroup’s presence at the Chicago event underscores the industry's shift toward highly customizable, high-speed digital workflows. For converters looking to reduce waste and increase output, these demos provide a practical look at how hardware and software integration can streamline production.
What to Expect at Booths 628 and 637
LemuGroup is splitting its presence across two booths to cover distinct areas of label converting. At booth 628, the focus is on versatility and digital finishing, while booth 637 emphasizes quality control and high-speed inspection.
- MI 350 Inkjet Digital Module: Features on-demand varnish injection capable of creating raised visual effects and Braille markings.
- BOSS Configurable Digital Finishing Line: Paired with the GTU-26 glueless automatic turret rewinder, this line handles semi-rotary die cutting, inspection, and slitting at speeds up to 820 fpm.
- RDX RFID Inserter: Demonstrates single-pass inlay insertion with integrated validation and placement accuracy of +/- 1 mm.
- I-Max Inspection Slitter Rewinder: Located at booth 637 in collaboration with BST North America, this system focuses on defect detection and quality control at speeds reaching 1,800 fpm.
At booth 628, we will showcase LemuGroup's new solutions featuring modular digital finishing equipment, automated processing and rewinding, as well as RFID insertion. At booth 637, our collaboration with BST will show how inspection and defect detection can connect with reliable roll production.
— Eider Lizarbe, Marketing Manager at LemuGroup
Why This Matters for the Packaging Industry
The integration of digital finishing and automated inspection is no longer just a luxury—it is becoming a requirement for profitability. By showcasing workflows that emphasize immediate job changes and closed-loop tension control, LemuGroup is addressing two of the industry’s biggest pain points: downtime and material waste.
As converters face increasing pressure to handle shorter run lengths without sacrificing quality, the ability to combine varnish, RFID insertion, and die-cutting into a single-pass workflow is a massive advantage. These demonstrations at LOUPE Americas 2026 offer a glimpse into how the next generation of packaging will be produced.